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Parylene Nano Materials of Our Company
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Other Materials
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Record Data With
ASTM Test Method
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Parylene
AF4
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Parylene
C
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Parylene
D
|
Parylene
F
|
Parylene
N
|
Test Method
(ASTM)
|
ER
(Epoxy Resin)
|
SR
(Silicone Resin)
|
UR
(PUR Polyurethane)
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AR (polya Crylic Ester)
|
UV (polya Crylic Ester) |
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Dielectric Strength
DC(V/mil)
|
5400
|
5600
|
5500
|
5500
|
7000
|
D149
|
900-1000
|
1100-2000
|
1400-3000
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1200-2000
|
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Volume Resistivity
Ω.Cm 23*C 50%RH
|
2×1017
|
6-8×1016
|
1.2×1016
|
2×1017
|
1.4X1017
|
D257
|
1012-17
|
1015-16
|
1011-15
|
1013-14
|
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Surface Resistance Ω
|
1015
|
1014
|
1016
|
5×1017
|
1013
|
D257
|
1013
|
1013
|
-
|
1014
|
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Dielectric Constant
|
60Hz
|
2.21
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3.15
|
2.84
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2.25
|
2.65
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D150
|
3.5-5.0
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2.7-3.1
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5.7-7.8
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3-4
|
|
lKHz
|
2.20
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3.10
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2.82
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2.10
|
2.65
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D150
|
3.S-4.5
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2.6-2.7
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5.4-7.6
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2.5-5
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1MHz
|
2.17
|
2.95
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2.80
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2.16
|
2.65
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D150
|
3.3-4.0
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2.6-2.7
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4.2-5.2
|
3-4
|
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Dissiption Loss
|
60Hz
|
＜0.0002
|
0.02
|
0.004
|
0.0002
|
0.0002
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D150
|
0.002-0.01
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0.001-0.007
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0.015-0.05
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0.2-0.4
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lKHz
|
0.0020
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0.019
|
0.003
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0.0020
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0.0002
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D150
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0.002-0.02
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0.001-0.005
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0.04-0.06
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0.02-0.02
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1MHz
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0.0010
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0.013
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0.002
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0.0010
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0.0006
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D150
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0.03-0.05
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0.001-0.002
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0.05-0.07
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0.035-0.056
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1GHz
|
-
|
0.0043
|
-
|
-
|
-
|
-
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-
|
-
|
-
|
-
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10GHz
|
-
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0.0032
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-
|
-
|
-
|
-
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-
|
-
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-
|
-
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Young Modululus Mpa
|
3000
|
3200
|
2800
|
-
|
2400
|
-
|
2400
|
720
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80-800
|
480
|
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Tensile Strength Mpa
|
55
|
70
|
75
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52
|
45
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D882
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28-91
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5.6-7
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1.13-70
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32-77
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Breaking Elongation ％
|
200
|
200
|
10
|
200
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20-250
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D882
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3-6
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100
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100-1000
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3-85
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Hygroscopicity %24 24h
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<0.01
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<0.1
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<0.1
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<0.009
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<0.1
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D570
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0.08-0.15
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0.12
（Seven Days）
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0.02-0.45
|
-
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Hardness
|
R122
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R80
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R80
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-
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R85
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D785
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M80-110
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40-45 HS
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10A-25DHS
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H-2H
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Pencil Hardness
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-
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2H
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-
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-
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3B
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JISK
5600-5-4
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-
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-
|
-
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|
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Dilatation Coefficient
|
Static
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0.15
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0.29
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0.33
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0.14
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0.25
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D1894
|
-
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1.0
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-
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|
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Dynamic
|
0.13
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0.29
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0.31
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0.13
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0.25
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D1894
|
-
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1.0
|
-
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|
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Melting Point °C
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＞500
|
290
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380
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＞460
|
420
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D3417
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Solidify
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Solidify
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170 or Solidify
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Used In Air °C
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-200°~450°
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-200°~120°
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-200°~140°
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-200°~280°
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-200°~120°
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-
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-64°~199°
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-45°~110°
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-59°~137°
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Liner Expansion Coefficient 25°C 10-5/°C
|
4.5
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3.5
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3-8
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3.6
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6.9
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-
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4.565
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25-30
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10-20
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0.5-15
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Thermal Conductivity 10-4 Cal/cm.s/C
|
0.096
|
2.0
|
-
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0.096
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3.0
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-
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4-5
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3.5-7.5
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5.0
|
36
|
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Specific Heat 20°C
|
1.04
|
0.17
|
-
|
-
|
0.2
|
-
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0.25
|
-
|
0.42
|
-
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Water Vapor Permeability 37°C 90% RH g.mil/100in2.d
|
0.32
|
0.21
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13.5
|
0.25-0.36
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1.5
|
-
|
6.6
|
-220
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20.2
|
27.8
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Protective Performance of Parylene Nano
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Gas Permeability cm3-mil/100
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Parylene C
|
Parylene D |
Parylene N
|
|
Nitrogen
|
0.95
|
4.5 |
7.7
|
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Oxygen
|
7.1
|
32 |
30
|
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Carbon Dioxide
|
7.7
|
13 |
214
|
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Hydrogen Sulfide
|
13
|
1.45 |
795
|
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Chlorine Gas
|
11
|
4.75 |
1.890
|
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Sulfur Dioxide
|
0.35
|
0.55 |
74
|
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Water Vapor Transmission 2-24 Hours With Atmospheric Pressure at 23℃
|
0.14
|
0.25 |
1.5
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Thermal Performance
|
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Melting Points（°C）
|
290
|
380 |
410
|
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Linear Expansion Coefficient
（10-5/°C）
|
3.5
|
NA |
6.9
|
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Thermal Conductivity
（cm2°C /cm）
|
2.0
|
NA |
3.0
|
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Physical & Mechanical Properties
|
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Tensile Strength PSI
|
10000
|
1100 |
6500
|
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Tensile Modulus MPA
|
69
|
76 |
45
|
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Yield Strength PSI
|
8000
|
9000 |
6300
|
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Yield Elongation MPA
|
3200
|
2800 |
2400
|
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Elongation at Break%
|
200
|
10 |
40
|
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Density g/cm3
|
1.289
|
1.418 |
1.110
|
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Coeffcient of Friction: Static)
|
0.29
|
0.33 |
0.25
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Coeffcient of Friction: Dynamic
|
0.29
|
0.31 |
0.25
|
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Water Absorption% (24 hours)
|
0.06
|
NA |
0.01
|
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Refractive Index Nd23
|
1.639
|
1.669 |
1.661
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Solvent Resistance Immerse The Film With 0.5-1.5 mil in 0.5-1.5 mil in Various Solvents at Room Temperature
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|
Isopropyl Alcohol
|
0.1
|
0.1 |
0.3
|
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Isooctane
|
0.4
|
0.3 |
0.2
|
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Pyridine
|
0.5
|
0.5 |
0.2
|
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Mixed Xylenes
|
2.3
|
1.1 |
1.4
|
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Trichlorethylene
|
0.8
|
0.8 |
0.5
|
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Chlorobenzene
|
1.5
|
1.5 |
1.1
|
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Dichlorobenzene
|
3.0
|
1.8 |
0.2
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Trichlorotrifluoroethane
|
0.2
|
0.2 |
0.2
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Acetone
|
0.9
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0.4 |
0.3
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A-Pentanedione
|
1.2
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1.4 |
0.6
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Deionized Water
|
0
|
0 |
0
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Cyclic Damp Heat Test Of Coated Circuit Board
Insulation Resistance (Ohm) MIL-STD-202 Method 302
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Parylene C
Thickness (in)
|
Initial Measurement
23℃ 50% RH
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Precycling 23 ℃
90%RH
|
Cycle 3 Step 5
65℃ 90%RH
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Cycle 7 Step 5
65℃ 90%RH
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Cycle 10 Step 5
65℃ 90%RH
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Cycle 10 Step 7
65℃ 90%RH
|
|
0.002
|
2.0×1014
|
1.8×1013
|
2.3×1012
|
2.5×1011
|
1.4×1011
|
7.5×1012
|
|
0.0015
|
5.0×1014
|
2.4×1013
|
8.6×1011
|
1.9×1011
|
1.1×1011
|
5.2×1012
|
|
0.001
|
2.0×1014
|
9.2×1012
|
8.1×1011
|
3.4×1011
|
1.3×1011
|
6.3×1012
|
|
0.0005
|
5.0×1014
|
2.3×1013
|
4.1×1012
|
2.4×1011
|
1.1×1011
|
4.7×1012
|
|
0.0003
|
5.0×1014
|
2.7×1013
|
4.4×1012
|
9.0×1010
|
4.7×1010
|
2.9×1012
|
|
0.0001
|
5.0×1014
|
3.2×1010
|
1.3×1011
|
1.1×1011
|
6.4×1010
|
2.3×1012
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| Gas And Moisture Isolation |
|
Gas Permeablity at 25℃ {cm3(STP).mil} (100in2/d.atm)
|
90%RH37℃（Water Vapor)
g.mil/100in2.d
|
|
|
CO2
|
CL2
|
H2
|
H2S
|
N2
|
O2
|
SO2
|
|
|
Parylene C
|
7.7
|
0.35
|
110
|
13
|
1.0
|
7.2
|
11
|
0.21
|
|
Parylene N
|
214
|
74
|
540
|
795
|
7.7
|
39
|
1890
|
1.50
|
|
Epoxy Resin
|
8
|
-
|
110
|
-
|
4
|
5-10
|
-
|
6.6
|
|
Silicone Resin
|
300000
|
-
|
45000
|
-
|
-
|
50000
|
-
|
220
|
|
Polyurethane
|
3000
|
-
|
-
|
-
|
80
|
200
|
-
|
20.2
|
|
Polypropylene
Resin
|
1433
|
-
|
-
|
-
|
152
|
716
|
-
|
27.8
|
Acid & Alkali Corrosion-The Thickness Of The Film With 0.5-1.5 mil Was Varied At Room Temperature After 90 Minutes Of Immersion In Various Reagents (%) (Infrared Measurement)
|
Reagent Varieties
|
Concentration (%)
|
Praylene C (%)
|
Praylene D (%)
|
Praylene N (%)
|
|
Hydrochloric Acid
|
10
|
0.0
|
0.1
|
0
|
|
Concentrated Hydrochloric Acid
|
37
|
0
|
0.5
|
0.2
|
|
Sulfuric Acid
|
10
|
0.3
|
0.2
|
0.1
|
|
Concentrated Sulfuric Acid
|
95-98
|
0.4
|
0.8
|
0.2
|
|
Nitric Acid
|
10
|
0.1
|
0.2
|
0.1
|
|
Concentrated Nitric Acid
|
71
|
0.2
|
0.5
|
0.2
|
|
Butyric Acid
|
10
|
0.1
|
0.1
|
0.1
|
|
Concentrated Butyric Acid
|
74
|
0
|
0.2
|
0.3
|
|
Strong Alkali (NaOH)
|
10
|
0
|
0.1
|
0.1
|
|
Weak Alkalis (NH4OH)
|
10
|
0.2
|
0.1
|
0.3
|
